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copper 1 nitride (CuN) is an inert, stable, non-toxic, and high-resistivity raw material used for optical information storage, and fast integrated circuits. It has a lower thermal decomposition temperature than tellurium elements. It is also less prone to etching in HCl than pure copper. Heeger Materials offers high-quality copper nitride powder with various particle sizes, crystallographic orientations, and surface morphologies for use in various applications.
In CO2 reduction, Cu metal promotes CH4 production with selectivity favored by oxide-derived Cu species due to high local pH, heterogeneity at the grain boundaries, and residual oxygen14–16. In contrast, polycrystalline Cu metal with nitride-derived Cu promotes C2+ products17–19. A key factor in this difference is the stability of the active Cu+ species in support, which may be influenced by the presence of a nitride layer on the surface16,18,19,20.
X-ray photoelectron spectroscopy (XPS) measurements of the Cu-nitride samples show that the surface is mostly reduced to Cu+ after the initial 60 min of reaction, and this behavior is maintained over 30 h. In situ XAS and HRTEM-EELS mapping reveal that the nitride supports stabilize the surface Cu+ to a greater degree than does the cube structure, leading to enhanced selectivity toward C2+ (Supplementary Fig. 6)27.
In addition, DFT calculations using the atomically exact Coulomb interaction model show that the nitride support suppresses the partial oxidation of the Cu-surface metal by increasing its binding energy to O, which leads to a reduction in the adsorption and dimerization energies of intermediate CO. This result is consistent with the experimental observations and is a key finding in our study of the role of nitride in the CO-based reaction system.